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Community","2025-10-03T12:43:45.023Z","2025-10-03T12:43:47.107Z","2025-10-03T12:43:47.100Z","235",{"id":1325,"name":1326,"alternativeText":7,"caption":7,"width":1327,"height":1328,"formats":1329,"hash":1352,"ext":1131,"mime":1134,"size":1353,"url":1354,"previewUrl":7,"provider":21,"provider_metadata":7,"createdAt":1355,"updatedAt":1355},302,"190107IMTCFoutlines.jpg",1780,753,{"large":1330,"small":1336,"medium":1341,"thumbnail":1347},{"ext":1131,"url":1331,"hash":1332,"mime":1134,"name":1333,"path":7,"size":1334,"width":57,"height":1335},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/large_190107_IMTC_Foutlines_d671f7cebb.jpg","large_190107_IMTC_Foutlines_d671f7cebb","large_190107IMTCFoutlines.jpg",36.68,423,{"ext":1131,"url":1337,"hash":1338,"mime":1134,"name":1339,"path":7,"size":1340,"width":64,"height":435},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/small_190107_IMTC_Foutlines_d671f7cebb.jpg","small_190107_IMTC_Foutlines_d671f7cebb","small_190107IMTCFoutlines.jpg",16.78,{"ext":1131,"url":1342,"hash":1343,"mime":1134,"name":1344,"path":7,"size":1345,"width":71,"height":1346},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/medium_190107_IMTC_Foutlines_d671f7cebb.jpg","medium_190107_IMTC_Foutlines_d671f7cebb","medium_190107IMTCFoutlines.jpg",26.61,317,{"ext":1131,"url":1348,"hash":1349,"mime":1134,"name":1350,"path":7,"size":1351,"width":78,"height":1243},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/thumbnail_190107_IMTC_Foutlines_d671f7cebb.jpg","thumbnail_190107_IMTC_Foutlines_d671f7cebb","thumbnail_190107IMTCFoutlines.jpg",6.64,"190107_IMTC_Foutlines_d671f7cebb",69.47,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/190107_IMTC_Foutlines_d671f7cebb.jpg","2025-10-03T12:43:30.587Z",{"id":929,"variation":852,"button":1357},[1358],{"id":1359,"label":89,"size":90,"color":91,"style":7,"icon":92,"iconPosition":93,"url":1360,"newWindow":8,"downloadable":7,"shape":7},113,"https://ieeememstc.org/","-193",{"id":247,"name":1363,"description":41,"createdAt":1364,"updatedAt":1365,"publishedAt":1366,"url_path_id":1367,"logo":1368,"website":1398,"url_path":1403},"IEEE Sensors Journal","2025-10-07T18:27:56.676Z","2025-10-07T18:27:58.926Z","2025-10-07T18:27:58.918Z","236",{"id":1369,"name":1370,"alternativeText":7,"caption":7,"width":1371,"height":1372,"formats":1373,"hash":1394,"ext":17,"mime":18,"size":1395,"url":1396,"previewUrl":7,"provider":21,"provider_metadata":7,"createdAt":1397,"updatedAt":1397},305,"sensors-journal-25-years-hr_color.png",4280,953,{"large":1374,"small":1379,"medium":1384,"thumbnail":1389},{"ext":17,"url":1375,"hash":1376,"mime":18,"name":1377,"path":7,"size":1378,"width":57,"height":830},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/large_sensors_journal_25_years_hr_color_4f826a1bfe.png","large_sensors_journal_25_years_hr_color_4f826a1bfe","large_sensors-journal-25-years-hr_color.png",79.34,{"ext":17,"url":1380,"hash":1381,"mime":18,"name":1382,"path":7,"size":1383,"width":64,"height":65},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/small_sensors_journal_25_years_hr_color_4f826a1bfe.png","small_sensors_journal_25_years_hr_color_4f826a1bfe","small_sensors-journal-25-years-hr_color.png",35.7,{"ext":17,"url":1385,"hash":1386,"mime":18,"name":1387,"path":7,"size":1388,"width":71,"height":72},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/medium_sensors_journal_25_years_hr_color_4f826a1bfe.png","medium_sensors_journal_25_years_hr_color_4f826a1bfe","medium_sensors-journal-25-years-hr_color.png",55.68,{"ext":17,"url":1390,"hash":1391,"mime":18,"name":1392,"path":7,"size":1393,"width":78,"height":319},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/thumbnail_sensors_journal_25_years_hr_color_4f826a1bfe.png","thumbnail_sensors_journal_25_years_hr_color_4f826a1bfe","thumbnail_sensors-journal-25-years-hr_color.png",16.36,"sensors_journal_25_years_hr_color_4f826a1bfe",122.56,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/sensors_journal_25_years_hr_color_4f826a1bfe.png","2025-10-07T18:27:22.950Z",{"id":962,"variation":852,"button":1399},[1400],{"id":1401,"label":89,"size":90,"color":91,"style":7,"icon":92,"iconPosition":93,"url":1402,"newWindow":8,"downloadable":7,"shape":7},114,"https://ieee-sensors.org/ieee-sensors-journal/","-194",{"pagination":1405},{"page":5,"pageSize":155,"pageCount":5,"total":247},{"id":391,"heading":386,"pageHeader":1407,"sections":1409},{"id":391,"description":1408,"showPageHeader":8,"backgroundColor":107,"image":7},"Sunday, October 19, 2025",[1410,1422],{"id":1411,"__component":1412,"componentVariation":1413,"styles":1414,"header":1416,"body":1419},47,"content.content","Content Image Left",{"id":351,"edgeTop":106,"edgeBottom":106,"background":1415,"containerWidth":7},"base-50",{"id":574,"heading":7,"prose":1417,"lead":7,"eyebrow":7,"badge":7,"componentVariation":1418,"containerWidth":7,"image":7},"\u003Cp>*Pre-Conference Workshops are not included in full conference registration and require an additional payment to register to attend the sessions \u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://2025.ieee-sensorsconference.org/registration\">here\u003C/a>.\u003C/p>","Heading Center",{"id":954,"title":1420,"body":1421,"containerWidth":7,"buttonGroup":7,"media":7},"Pre-Conference Workshop Schedule","\u003Cfigure class=\"table\">\u003Ctable>\u003Cthead>\u003Ctr>\u003Cth style=\"border:1px solid hsl(0, 0%, 90%);text-align:center;\">PDT\u003C/th>\u003Cth style=\"border:1px solid hsl(0, 0%, 90%);padding:2px 3px;text-align:center;\">Fairview I-III\u003C/th>\u003Cth style=\"border:1px solid hsl(0, 0%, 90%);padding:2px 3px;text-align:center;\">Fairview IV-V\u003C/th>\u003Cth style=\"border:1px solid hsl(0, 0%, 90%);padding:2px 3px;text-align:center;\">Parq Salon A\u003C/th>\u003Cth style=\"border:1px solid hsl(0, 0%, 90%);padding:2px 3px;text-align:center;\">Parq Salon B\u003C/th>\u003C/tr>\u003C/thead>\u003Ctbody>\u003Ctr>\u003Ctd style=\"border:1px solid hsl(0, 0%, 90%);text-align:center;\">8:30-10:00\u003C/td>\u003Ctd style=\"border:1px solid hsl(0, 0%, 90%);padding:2px 3px;text-align:center;\" colspan=\"1\">Wireless and Batteryless Sensors: Towards AIoT\u003C/td>\u003Ctd style=\"border:1px solid hsl(0, 0%, 90%);padding:2px 3px;text-align:center;\" colspan=\"1\">Future CMOS Image Sensors for AI Era – AI or not\u003C/td>\u003Ctd style=\"border:1px solid hsl(0, 0%, 90%);padding:2px 3px;text-align:center;\" colspan=\"1\">\u003Cs>Collaborative Project Teaming in (Bio)sensor Technologies \u003C/s>Canceled\u003C/td>\u003Ctd style=\"border:1px solid hsl(0, 0%, 90%);padding:2px 3px;text-align:center;\" colspan=\"1\">Professional Development Programming for Young Professionals in Sensing\u003C/td>\u003C/tr>\u003Ctr>\u003Ctd style=\"border:1px solid hsl(0, 0%, 90%);text-align:center;\">10:00-10:30\u003C/td>\u003Ctd style=\"border:1px solid hsl(0, 0%, 90%);text-align:center;\" colspan=\"4\">Coffee Break\u003C/td>\u003C/tr>\u003Ctr>\u003Ctd style=\"border:1px solid hsl(0, 0%, 90%);text-align:center;\">10:30-12:00\u003C/td>\u003Ctd style=\"border:1px solid hsl(0, 0%, 90%);padding:2px 3px;text-align:center;\" colspan=\"1\">Wireless and Batteryless Sensors: Towards AIoT\u003C/td>\u003Ctd style=\"border:1px solid hsl(0, 0%, 90%);padding:2px 3px;text-align:center;\" colspan=\"1\">Future CMOS Image Sensors for AI Era – AI or not\u003C/td>\u003Ctd style=\"border:1px solid hsl(0, 0%, 90%);padding:2px 3px;text-align:center;\" colspan=\"1\">\u003Cs>Collaborative Project Teaming in (Bio)sensor Technologies \u003C/s>Canceled\u003C/td>\u003Ctd style=\"border:1px solid hsl(0, 0%, 90%);padding:2px 3px;text-align:center;\" colspan=\"1\">Professional Development Programming for Young Professionals in Sensing\u003C/td>\u003C/tr>\u003Ctr>\u003Ctd style=\"border:1px solid hsl(0, 0%, 90%);text-align:center;\">12:00-13:30\u003C/td>\u003Ctd style=\"border:1px solid hsl(0, 0%, 90%);text-align:center;\" colspan=\"4\">\u003Cp>Lunch\u003C/p>\u003Cp>Parq Salon F\u003C/p>\u003C/td>\u003C/tr>\u003Ctr>\u003Ctd style=\"border:1px solid hsl(0, 0%, 90%);text-align:center;\">13:30-15:00\u003C/td>\u003Ctd style=\"border:1px solid hsl(0, 0%, 90%);padding:2px 3px;text-align:center;\" colspan=\"1\">\u003Cs>Exploring Consumer Inertial MEMS – High-Tech Sensors at Your Fingertips \u003C/s>Canceled\u003C/td>\u003Ctd style=\"border:1px solid hsl(0, 0%, 90%);padding:2px 3px;text-align:center;\" colspan=\"1\">Future CMOS Image Sensors for AI Era – AI or not\u003C/td>\u003Ctd style=\"border:1px solid hsl(0, 0%, 90%);padding:2px 3px;text-align:center;\" colspan=\"1\"> \u003C/td>\u003Ctd style=\"border:1px solid hsl(0, 0%, 90%);padding:2px 3px;text-align:center;\" colspan=\"1\">Emerging Trends in Chemical and Biochemical Sensors: MEMS, Electrochemical, and Optical Platform\u003C/td>\u003C/tr>\u003Ctr>\u003Ctd style=\"border:1px solid hsl(0, 0%, 90%);text-align:center;\">15:00-15:30\u003C/td>\u003Ctd style=\"border:1px solid hsl(0, 0%, 90%);text-align:center;\" colspan=\"4\">Coffee Break\u003C/td>\u003C/tr>\u003Ctr>\u003Ctd style=\"border:1px solid hsl(0, 0%, 90%);text-align:center;\">15:30-17:30\u003C/td>\u003Ctd style=\"border:1px solid hsl(0, 0%, 90%);padding:2px 3px;text-align:center;\" colspan=\"1\">\u003Cs>Exploring Consumer Inertial MEMS – High-Tech Sensors at Your Fingertips\u003C/s> Canceled\u003C/td>\u003Ctd style=\"border:1px solid hsl(0, 0%, 90%);padding:2px 3px;text-align:center;\" colspan=\"1\">Future CMOS Image Sensors for AI Era – AI or not\u003C/td>\u003Ctd style=\"border:1px solid hsl(0, 0%, 90%);padding:2px 3px;text-align:center;\" colspan=\"1\"> \u003C/td>\u003Ctd style=\"border:1px solid hsl(0, 0%, 90%);padding:2px 3px;text-align:center;\" colspan=\"1\">Emerging Trends in Chemical and Biochemical Sensors: MEMS, Electrochemical, and Optical Platform\u003C/td>\u003C/tr>\u003C/tbody>\u003C/table>\u003C/figure>",{"id":144,"__component":1423,"componentVariation":1424,"contactsVariation":1425,"styles":7,"header":7,"sessionsGroup":1426},"content.sessions","Sessions Base","Card Contact Full",[1427],{"id":144,"groupTitle":7,"sessions":1428},[1429,1525,1816,1934,2062],{"id":185,"session":1430},{"id":185,"title":1431,"teaser":1432,"body":1433,"createdAt":1434,"updatedAt":1435,"publishedAt":1436,"url_path_id":1437,"contacts":1438,"url_path":1524},"Professional Development Programming for Young Professionals in Sensing","\u003Cp style=\"text-align:justify;\">Its never too early (or late) to begin preparing for your next steps. In this workshop series, we will offer key insights into how to begin to prepare for the next stage of your career. The content is specifically designed for students, postdoctoral researchers, and early industry professionals. The discussion will focus on both academic and industrial career paths, with the goal of providing you new insights and skills needed for success.\u003C/p>","\u003Cp style=\"text-align:justify;\">We will split the workshop into three sessions. The first two sessions will be led by Pallavi Eswara. In the first session, we will discuss methods for building your brand and professional activity. In this interactive session, students and postdocs will learn more about how to lay the foundation of how their experience will be perceived in the job market. The second session will focus on career exploration and preparation techniques through both presentation and guided discussion. The third session, led by Jason Weigold, will focus on the career exploration in industry process. Finally, the workshop will end with a question-and-answer panel. The panelists will discuss their experience in the hiring process and provide key insights related to successes they’ve experienced. The panel is designed to be interactive, with significant time allotted for audience questions. In summary, this workshop will provide valuable insight that will amplify your impact on the field of sensors for years to come.\u003C/p>","2025-06-27T13:28:21.946Z","2025-09-29T17:25:35.497Z","2025-06-27T13:28:23.900Z","164",[1439,1482],{"id":962,"name":1440,"committee":7,"position":7,"affiliation":1441,"email":7,"biography":1442,"createdAt":1443,"updatedAt":1444,"url_path_id":1445,"contactPhoto":1446,"socialLinks":1480,"url_path":1481},"Pallavi Eswara","University of Florida","\u003Cp style=\"text-align:justify;\">Pallavi Eswara, M.S., Human Genetics, is the Director, Prestigious Awards and Postdoctoral Affairs at the University of Florida. In this role, she works with national and university-funded fellowships for graduate students and postdocs, and also designs and executes postdoc professional development. Before that, she was the Director of Postdoctoral Affairs at Boston University, where she created and implemented professional development programs and community-building programs for postdocs. Additionally, she was also responsible for the policy and administrative aspects of postdoc training at BU. Pallavi has been recognized as a finalist for the Distinguished Staff Award by the National Postdoc Association (2024, 2025).\u003C/p>\u003Cp style=\"text-align:justify;\">She was the founding staff member and created the Office of Postdoctoral Affairs in 2007 at the Pennsylvania State University, University Park, PA, serving in various roles, including as the Director from 2016 to 2021. In this time, she established the Office of Postdoctoral Affairs to be the node for all postdoctoral professional development, training, outreach, and oversight of postdoc policy. Further, she was also a campus director of an AGEP grant from NSF to advance URM STEM postdocs in faculty careers in Big Ten institutions. She worked to revise the postdoc policy to include more equity and transparency around professional development, leave, and postdoc appointments. Pallavi also worked in graduate-level educational equity programs at Penn State (2011-14) and graduate operations at Northeastern University briefly before joining BU.\u003C/p>\u003Cp style=\"text-align:justify;\">She has facilitated workshops for faculty on mentoring, postdoc policy, and worked with stakeholders of early career researcher training in creating relevant professional development and learning opportunities at various U.S. universities, professional societies, organizations, and universities in India.\u003C/p>\u003Cp style=\"text-align:justify;\">Pallavi has served as a member of various committees in the National Postdoc Association (NPA) and Graduate Career Consortium (GCC). She was NPA’s Research Development Chair from 2009-11, and GCC executive committee member from 2019-21.\u003C/p>\u003Cp style=\"text-align:justify;\">Prior to her work in postdoc affairs, Pallavi was a researcher in bioinformatics at Penn State and worked on mouse, rat, and chicken genomes. She is also a champion of science outreach and has designed and presented several workshops and activities for K-12 students and adults.\u003C/p>","2025-06-27T13:26:03.594Z","2025-10-01T12:17:29.714Z","163",{"id":1447,"name":1448,"alternativeText":7,"caption":7,"width":1449,"height":1450,"formats":1451,"hash":1476,"ext":1131,"mime":1134,"size":1477,"url":1478,"previewUrl":7,"provider":21,"provider_metadata":7,"createdAt":1479,"updatedAt":1479},244,"Eswara25 headshot.jpg",5202,6502,{"large":1452,"small":1458,"medium":1464,"thumbnail":1470},{"ext":1131,"url":1453,"hash":1454,"mime":1134,"name":1455,"path":7,"size":1456,"width":1457,"height":57},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/large_Eswara25_headshot_b81488533f.jpg","large_Eswara25_headshot_b81488533f","large_Eswara25 headshot.jpg",107.41,800,{"ext":1131,"url":1459,"hash":1460,"mime":1134,"name":1461,"path":7,"size":1462,"width":1463,"height":64},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/small_Eswara25_headshot_b81488533f.jpg","small_Eswara25_headshot_b81488533f","small_Eswara25 headshot.jpg",28.94,400,{"ext":1131,"url":1465,"hash":1466,"mime":1134,"name":1467,"path":7,"size":1468,"width":1469,"height":71},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/medium_Eswara25_headshot_b81488533f.jpg","medium_Eswara25_headshot_b81488533f","medium_Eswara25 headshot.jpg",62.5,600,{"ext":1131,"url":1471,"hash":1472,"mime":1134,"name":1473,"path":7,"size":1474,"width":1475,"height":689},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/thumbnail_Eswara25_headshot_b81488533f.jpg","thumbnail_Eswara25_headshot_b81488533f","thumbnail_Eswara25 headshot.jpg",3.96,125,"Eswara25_headshot_b81488533f",3528.71,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/Eswara25_headshot_b81488533f.jpg","2025-06-27T15:14:02.266Z",[],"-133",{"id":1483,"name":1484,"committee":7,"position":7,"affiliation":1485,"email":7,"biography":1486,"createdAt":1487,"updatedAt":1487,"url_path_id":1488,"contactPhoto":1489,"socialLinks":1522,"url_path":1523},110,"Jason Weigold","MEMStaff Inc.","\u003Cp style=\"text-align:justify;\">Jason Weigold has been working in the MEMS industry for more than 30 years.  He earned the BSEE degree from the University of California at Los Angeles (UCLA) in 1995 and the MSEE in 1997 and Ph.D. degree in 2000 from the University of Michigan with a specialization in MEMS.  Jason is the founder and President of MEMStaff Inc., a staffing company that places employees and executives throughout the semiconductor industry, particularly the MEMS industry.  Prior to that, he was a Staff Development Engineer in Analog Devices’ Advanced Development Group developing new MEMS products for various markets.  Jason worked on a variety of MEMS products including inertial sensors and microphones.  He developed ADI’s MEMS microphone which sold over 150 million units and was in the Apple iPod, iPad2, and iPhone5.  The business unit created was sold in 2013 to Invensense (INVN) for $100M+.  Jason has worked in a variety of areas within MEMS product development as well as on a variety of MEMS products types.  He has developed MEMS sensors that have been sold into the automotive, consumer, and various other markets.   Jason currently serves on the board of directors of the Transducer Research Foundation (TRF) and formerly served on the board of directors of the MEMS and Sensors Industry Group.\u003C/p>","2025-08-05T22:20:56.497Z","207",{"id":1490,"name":1491,"alternativeText":7,"caption":7,"width":1492,"height":1493,"formats":1494,"hash":1518,"ext":1131,"mime":1134,"size":1519,"url":1520,"previewUrl":7,"provider":21,"provider_metadata":7,"createdAt":1521,"updatedAt":1521},274,"J_Weigold_Photo.jpg",1033,1244,{"large":1495,"small":1501,"medium":1507,"thumbnail":1513},{"ext":1131,"url":1496,"hash":1497,"mime":1134,"name":1498,"path":7,"size":1499,"width":1500,"height":57},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/large_J_Weigold_Photo_c6a7ff2442.jpg","large_J_Weigold_Photo_c6a7ff2442","large_J_Weigold_Photo.jpg",88.66,830,{"ext":1131,"url":1502,"hash":1503,"mime":1134,"name":1504,"path":7,"size":1505,"width":1506,"height":64},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/small_J_Weigold_Photo_c6a7ff2442.jpg","small_J_Weigold_Photo_c6a7ff2442","small_J_Weigold_Photo.jpg",26.82,415,{"ext":1131,"url":1508,"hash":1509,"mime":1134,"name":1510,"path":7,"size":1511,"width":1512,"height":71},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/medium_J_Weigold_Photo_c6a7ff2442.jpg","medium_J_Weigold_Photo_c6a7ff2442","medium_J_Weigold_Photo.jpg",54.51,623,{"ext":1131,"url":1514,"hash":1515,"mime":1134,"name":1516,"path":7,"size":1517,"width":647,"height":689},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/thumbnail_J_Weigold_Photo_c6a7ff2442.jpg","thumbnail_J_Weigold_Photo_c6a7ff2442","thumbnail_J_Weigold_Photo.jpg",4.01,"J_Weigold_Photo_c6a7ff2442",130.39,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/J_Weigold_Photo_c6a7ff2442.jpg","2025-08-05T22:20:32.124Z",[],"-175","-134",{"id":204,"session":1526},{"id":204,"title":1527,"teaser":1528,"body":1529,"createdAt":1530,"updatedAt":1531,"publishedAt":1532,"url_path_id":1533,"contacts":1534,"url_path":1815},"Future CMOS Image Sensors for AI Era – AI or not","\u003Cp style=\"text-align:justify;\">Artificial intelligence (AI) is becoming increasingly integrated into our daily lives. In particular, Deep Neural Networks (DNNs) are expected to merge with CMOS Image Sensors (CISs), which, soon, will open up a new era of smart, adaptive, and autonomous systems in various consumer electronics, such as smartphones, automotive technology, and augmented/virtual reality glasses.   \u003C/p>","\u003Cp style=\"text-align:justify;\">This workshop will focus on the future CISs that incorporate state-of-the-art computational image sensor processors (ISPs). These capabilities have evolved from traditional computation to DNNs in the AI era. Industry leaders and academic researchers will present invited talks covering two major topics: \u003Cbr>1. Trends in CISs technology focused on computation, including neural networks for future applications and associated software.\u003Cbr>2. Sensor technologies and ISPs designed for the AI era, and Sensor simulations tailored for future CISs\u003C/p>\u003Cp style=\"text-align:justify;\">We believe this workshop will pave the way for advancements in future imaging and sensing technology.   We encourage all attendees of the IEEE SENSORS 2025 conference to engage in discussions about \"Future CMOS Image Sensors for AI Era – AI or not\". \u003C/p>\u003Cfigure class=\"image\">\u003Cimg src=\"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/Screenshot_2025_10_17_094358_6e77435859.png\">\u003C/figure>\u003Cp style=\"text-align:justify;\">\u003Cstrong>There is nothing artificial in the role image sensors play in Artificial Intelligence\u003C/strong>\u003Cbr>Daniel McGrath, TechInsights, San Jose, CA, 95110, USA\u003Cbr>dmcgrath@techinsights.com \u003Ca href=\"mailto:dmcgrath@ieee.org\">dmcgrath@ieee.org\u003C/a>\u003C/p>\u003Cp style=\"text-align:justify;\">While much of the focus on artificial intelligence is on the “Cloud”, a brain that cannot sense the world around it is not viable. Vision provides a rich and complex example of this connection, and, because of this, image sensor technology has been a leader in addressing what the “Edge of the Cloud” will look like (and look at). The good news is that with its central role in smartphones and automotive and with its cost-effective penetration into other applications, there has been continual support for technical innovation to explore this space.\u003C/p>\u003Cp style=\"text-align:justify;\">The first challenge of “Imaging at the Edge” is to provide a performance level of sensing required in a manufacturable process flow. This has been accomplished by building on a well-established CMOS process flow and device base. Beyond this (despite the early aspirations), one must add the process enhancements to integrate the optical nature of the pixel and to provide the integration of the large array format required for photographic, video, and computational imaging.\u003C/p>\u003Cp style=\"text-align:justify;\">The second challenge of “Imaging at the Edge” is the trade-off concerning the amount of local processing to provide. The challenge is for form factor, power, and system considerations. In present systems, the question is whether neural networks will replace computational signal chains.\u003C/p>\u003Cp style=\"text-align:justify;\">This presentation will address, through TechInsights’ reverse engineering, advances in image sensor technology, including the increase in pixel functionality both in CIS and iToF, and the introduction of nanostructures to improve optical performance. It will touch on the challenges of detecting neural networks and cybersecurity in the stacked image processing die.\u003C/p>\u003Cp style=\"text-align:justify;\">\u003Cstrong>AI Sensors for Wearables\u003C/strong>\u003Cbr>Zhao Wang, META, Redmond, WA\u003C/p>\u003Cp style=\"text-align:justify;\">Wearable AI devices, particularly smart and augmented reality (AR) glasses, are poised to transform how we live and work by providing all-day, natural, and immersive user experiences. This presentation explores the design and implementation of AI sensors tailored for wearable devices, focusing on enabling always-on, low-latency, and context-aware AI functionalities.\u003C/p>\u003Cp style=\"text-align:justify;\">We discuss the system architecture of wearable AI devices, highlighting the challenges of traditional camera pipelines such as high power consumption and latency. To address these, we introduce AI sensor solutions that integrate advanced sensor technologies with on-sensor and near-sensor compute capabilities. Key innovations include digital pixel sensors with global shutter and high dynamic range, fully integrated AI sensors supporting multiple imaging modes and on-sensor DNN pipelines, and near-sensor compute architectures leveraging heterogeneous RISC-V SoCs for efficient machine learning inference.\u003C/p>\u003Cp style=\"text-align:justify;\">The presentation covers sensor requirements for wearables, including low power consumption, high sensitivity, and support for multiple regions of interest. We demonstrate how AI sensors enable proactive event detection, gesture recognition, text and object detection, and other contextual AI workloads directly on the sensor, significantly reducing system power and latency.\u003C/p>\u003Cp style=\"text-align:justify;\">Finally, we discuss system-level optimization strategies that balance sensor design, ML accelerator capabilities, algorithm development, and software frameworks to deliver optimal performance for wearable AI applications.\u003Cbr>This work represents a holistic approach to AI sensor design, enabling next-generation wearable devices with enhanced user experiences and new AI-driven capabilities.\u003C/p>\u003Cp style=\"text-align:justify;\">\u003Cstrong>CMOS Image Sensors; With or without embedded AI?\u003C/strong>\u003Cbr>Johannes Solhusvik, Sony Semiconductor Solutions Europe\u003C/p>\u003Cp style=\"text-align:justify;\">The AI revolution presents new opportunities for integrating intelligence into CMOS image sensors (CIS). However, embedding AI also poses certain challenges. This presentation will explore these considerations. We will discuss recent CMOS image sensors developed by Sony, some of which incorporate embedded AI processing functions, while others depend on off-chip processing to achieve the desired functionality and performance. A comparison of chip architecture, functions, features, and performance will be provided, along with an explanation of target applications.\u003C/p>\u003Cp style=\"text-align:justify;\">\u003Cstrong>Metaphotonic Breakthroughs in CMOS Image Senors: Unlocking Next-Generation Performance for AI-Driven Applications\u003C/strong>\u003Cbr>Seokho Yun, Samsung Advanced Institute of Technology\u003C/p>\u003Cp style=\"text-align:justify;\">This talk will introduce cutting-edge advancements in metaphotonics, featuring dispersion-engineered metasurfaces and color-routing nanostructures that significantly enhance color separation, reduce crosstalk, and boost light collection. We will also examine the concurrent optimization of these meta-optical components with neural ISPs and AI-based image processing, yielding next-generation CMOS image sensors optimized for AI-driven applications.\u003C/p>\u003Cp style=\"text-align:justify;\">\u003Cstrong>Simulation technologies for image systems\u003C/strong> \u003Cbr>Brian A. Wandell\u003Cbr>Stein Family Professor of Psychology\u003Cbr>Electrical Engineering, Ophthalmology and Graduate School of Education (by courtesy)\u003Cbr>Stanford University\u003C/p>\u003Cp style=\"text-align:justify;\">The landscape of imaging systems has expanded dramatically in recent decades, finding widespread application in fields such as mobile communication, medicine, robotics, automotive technology, and drone vehicles. These systems are increasingly coupled with deep learning methodologies, which demand substantial training datasets. Consequently, software prototyping has become indispensable for the design, evaluation, and training of contemporary image systems. In this presentation, I will introduce two closely related, open-source, and freely accessible image system toolboxes – ISETCam and ISET3d – designed to facilitate the comprehensive design and evaluation of entire image systems. I will illustrate how we model both the three-dimensional scene's spectral radiance and the hardware components of image systems, including multi-element lenses and image sensors. Finally, I will present several examples - both split pixel HDR, RGBW and RGB - demonstrating the application of end-to-end image system simulation for effective image sensor evaluation.\u003C/p>\u003Cp style=\"text-align:justify;\">Related publications\u003Cbr>1. ISETHDR: A Physics-based Synthetic Radiance Dataset for High Dynamic Range Driving Scenes (2025). Zhenyi Liu, Devesh Shah, Brian Wandell, IEEE Sensors. 10.1109/JSEN.2025.3550455.\u003Cbr>2. ISETAuto: Detecting vehicles with depth and radiance information (2021). Zhenyi Liu, Joyce Farrell, Brian Wandell, IEEE Access 10.1109/ACCESS.2021.3063692 3. Validation of Physics-Based Image Systems Simulation With 3-D Scenes (2022). Zheng Lyu, Thomas Goossens, Brian Wandell, Joyce Farrell IEEE Sensors, VOL. 22, NO. 20, 15 OCTOBER 2022\u003Cbr>4. See the wiki pages of the repositories at: \u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://github.com/ISET\">https://github.com/ISET\u003C/a>\u003C/p>\u003Cp style=\"text-align:justify;\">\u003Cstrong>Quanta Computational Imaging\u003C/strong>\u003Cbr>Mohit Guputa, The University of Wisconsin-Madison\u003C/p>\u003Cp style=\"text-align:justify;\">Single-photon avalanche diodes (SPADs) are an emerging sensor technology that promises single-photon sensitivity and the ability to time-tag photons with picosecond precision. In the last few years, we have witnessed a single-photon revolution, resulting for the first time in multi-megapixel SPAD arrays, which allow capturing sufficient spatial details needed for mainstream computer vision applications, including object detection and tracking, text recognition, pose recognition, and SLAM. This raises the following questions: Are SPADs ready to be used beyond niche scientific applications, as general-purpose computer vision sensors? Can they be deployed outside the lab in-the-wild? If so, what are their benefits over conventional cameras? We will discuss the opportunities for (and open challenges in) developing ``quanta’’ imaging / perception algorithms for extracting scene information from SPAD photon streams, with the goal of performing robust vision in extreme conditions including rapid motion, low light (~0.1 lux) and high dynamic range.\u003C/p>\u003Cp style=\"text-align:justify;\">\u003Cstrong>Multimodal sensor fusion technique for non-intrusive ultralow power occupancy detection\u003C/strong>\u003Cbr>Syed Salman Rahman, STMicroelectronics\u003C/p>\u003Cp style=\"text-align:justify;\">Presence detection has become an essential feature in smart home devices to enhance user experience and optimize energy efficiency while ensuring user privacy. We identify three main challenges with the currently available solutions: (1) reducing power consumption to enable battery-powered solutions, (2) limitations in the overall application-level performance, (3) non-intrusive method of contextual understanding. In this paper, we propose a novel sensor fusion technique using a combination of Infrared TMOS and Time of Flight (ToF) sensor technology from STMicroelectronics. This approach leverages the ultra-low power consumption of the TMOS sensor to constantly monitor user presence to instigate the system and activate the ToF sensor upon human presence detection to enable advanced features based on its multizone depth information. We present through this study that using the proposed solution reduces overall power consumption by 70 times compared to using ToF sensor standalone. The average power consumption is 0.05mW in non-engaged state, while having access to the ToF sensor’s reliable, accurate multizone data to induce additional features during active interaction and passing modes.\u003C/p>","2025-06-27T13:30:42.881Z","2025-10-18T16:40:01.273Z","2025-06-27T13:30:47.311Z","167",[1535,1565,1590,1613,1634,1675,1699,1734,1772],{"id":1536,"name":1537,"committee":7,"position":7,"affiliation":1538,"email":7,"biography":1539,"createdAt":1540,"updatedAt":1541,"url_path_id":1542,"contactPhoto":1543,"socialLinks":1563,"url_path":1564},87,"Daisuke Saito","OmniVision Technologies","\u003Cp style=\"text-align:justify;\">Daisuke Saito has over 15 years of experience in sensor research and development. He holds B.S. and M.S. degrees in applied physics from Tsukuba University, where he focused on light-emitting diodes.  Saito started his career at Sony Corporation as a device engineer and eventually became a section chief. He also studied at UC Berkeley as a visiting scholar and worked at imec for four years.\u003C/p>\u003Cp style=\"text-align:justify;\">He has also worked on LED displays, MEMS devices, emerging non-volatile memories, and in-memory computing. Since 2022, he has been with OMNIVISION in Santa Clara, CA, as a system designer for event-based vision sensors and deep neural network accelerators for Edge-AI technology.  Saito has authored over 15 scientific papers and holds over 25 pending or issued patents.\u003C/p>","2025-06-27T13:29:10.736Z","2025-09-14T13:22:56.459Z","165",{"id":1544,"name":1545,"alternativeText":7,"caption":7,"width":1546,"height":1547,"formats":1548,"hash":1560,"ext":1131,"mime":1134,"size":198,"url":1561,"previewUrl":7,"provider":21,"provider_metadata":7,"createdAt":1562,"updatedAt":1562},250,"Daisuke_Saito.jpg",509,514,{"small":1549,"thumbnail":1555},{"ext":1131,"url":1550,"hash":1551,"mime":1134,"name":1552,"path":7,"size":1553,"width":1554,"height":64},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/small_Daisuke_Saito_a3ae44cc67.jpg","small_Daisuke_Saito_a3ae44cc67","small_Daisuke_Saito.jpg",22.81,495,{"ext":1131,"url":1556,"hash":1557,"mime":1134,"name":1558,"path":7,"size":1559,"width":549,"height":689},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/thumbnail_Daisuke_Saito_a3ae44cc67.jpg","thumbnail_Daisuke_Saito_a3ae44cc67","thumbnail_Daisuke_Saito.jpg",3.62,"Daisuke_Saito_a3ae44cc67","https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/Daisuke_Saito_a3ae44cc67.jpg","2025-06-30T12:22:26.390Z",[],"-135",{"id":1008,"name":1566,"committee":7,"position":7,"affiliation":1567,"email":7,"biography":1568,"createdAt":1569,"updatedAt":1570,"url_path_id":1571,"contactPhoto":1572,"socialLinks":1588,"url_path":1589},"Sozo Yokogawa","Sony Semiconductor Solutions Corporation","\u003Cp style=\"text-align:justify;\">S.Y. is the senior engineer of Sony Semiconductor Solutions Corporation, Japan. S.Y. has joined SONY Corporation in 2006 after he got PhD degree in Astrophysics in 2003 from Graduate University for Advanced Studies. His main expertise is nano-photonics and plasmonics technologies to improve and add new functions to CMOS Image Sensors (CISs). S.Y. had been at Caltech as visiting scholar from 2011-2012. S.Y. and his team won the Walter Kosonocky Award in 2019 from International Image Sensor Society (IISS). He served as the Optoelectronics, Displays, and Imaging System (ODI) subcommittee member of IEDM (International Electron Devices Meeting) from 2021 to 2022, and serve as the Industry co-Chair of IEEE Sensors from 2024.\u003C/p>","2025-06-27T13:29:31.946Z","2025-07-14T01:49:17.503Z","166",{"id":1573,"name":1574,"alternativeText":7,"caption":7,"width":1575,"height":1576,"formats":1577,"hash":1584,"ext":17,"mime":18,"size":1585,"url":1586,"previewUrl":7,"provider":21,"provider_metadata":7,"createdAt":1587,"updatedAt":1587},261,"Screenshot 2025-07-13 214714.png",384,461,{"thumbnail":1578},{"ext":17,"url":1579,"hash":1580,"mime":18,"name":1581,"path":7,"size":1582,"width":1583,"height":689},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/thumbnail_Screenshot_2025_07_13_214714_f104d02476.png","thumbnail_Screenshot_2025_07_13_214714_f104d02476","thumbnail_Screenshot 2025-07-13 214714.png",49.74,130,"Screenshot_2025_07_13_214714_f104d02476",77.67,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/Screenshot_2025_07_13_214714_f104d02476.png","2025-07-14T01:48:15.352Z",[],"-136",{"id":191,"name":1591,"committee":7,"position":7,"affiliation":1592,"email":7,"biography":1593,"createdAt":1594,"updatedAt":1594,"url_path_id":1595,"contactPhoto":1596,"socialLinks":1611,"url_path":1612},"Johannes Solhusvik","Head of Sony Semiconductor Solutions Europe","\u003Cp style=\"text-align:justify;\">Johannes Solhusvik received his PhD in 1996 on CCD and CMOS image sensor (CIS) design at ISAE, Toulouse, France. After which he joined ABB Corporate Research, Norway. In 1999 he established Photobit (Norway) CIS design center which became Micron (Norway) in 2001; during which he also worked part-time as Associate Adjunct Professor at Univ of Trondheim teaching CIS design. He expatriated in 2004-06 to Micron’s CIS design HQ in California from where he directed CIS design teams in USA, Japan, UK and Norway. He then repatriated to focus on CIS R&D and joined the Micron spin-off Aptina (Norway) in 2009 as CTO of the Automotive business unit.  He joined OmniVision (Norway) in 2012 as General Manager. From 2014 to 2022 he also had a 10% part-time position as Associate Adjunct Professor at Oslo University teaching CIS circuits and systems. Dr. Solhusvik joined Sony Nordic (Norway) in 2020 as Head of Automotive Design Center and was promoted to VP and Head of Sony Semiconductor Solutions Europe in 2023 which is his current main occupation. Dr. Solhusvik is a Distinguished Engineer at Sony and President of International Image Sensor Society (IISS). He has served multiple years as TPC member at IISW, ISSCC, and ESSCIRC.\u003C/p>","2025-08-19T20:40:29.106Z","212",{"id":1597,"name":1598,"alternativeText":7,"caption":7,"width":72,"height":1599,"formats":1600,"hash":1607,"ext":17,"mime":18,"size":1608,"url":1609,"previewUrl":7,"provider":21,"provider_metadata":7,"createdAt":1610,"updatedAt":1610},278,"Screenshot 2025-08-19 163939.png",194,{"thumbnail":1601},{"ext":17,"url":1602,"hash":1603,"mime":18,"name":1604,"path":7,"size":1605,"width":1606,"height":689},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/thumbnail_Screenshot_2025_08_19_163939_d7112bb326.png","thumbnail_Screenshot_2025_08_19_163939_d7112bb326","thumbnail_Screenshot 2025-08-19 163939.png",45.26,134,"Screenshot_2025_08_19_163939_d7112bb326",18.08,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/Screenshot_2025_08_19_163939_d7112bb326.png","2025-08-19T20:40:08.530Z",[],"-178",{"id":1359,"name":1614,"committee":7,"position":7,"affiliation":1615,"email":7,"biography":1616,"createdAt":1617,"updatedAt":1617,"url_path_id":1618,"contactPhoto":1619,"socialLinks":1632,"url_path":1633},"Mohit Gupta","University of Wisconsin-Madison","\u003Cp style=\"text-align:justify;\">Mohit Gupta is an Associate Professor of Computer Sciences at the University of Wisconsin-Madison. He received a Ph.D. from the Robotics Institute, Carnegie Mellon University, and was a postdoctoral research scientist at Columbia University. He directs the WISION Lab with research interests in computer vision and computational imaging. He has received best paper honorable mention awards at computer vision and photography conferences, including a Marr Prize honorable mention at IEEE ICCV, a best demo award at SIGGRAPH ETech 2024, Sony Faculty Innovation Awards and an NSF CAREER award. His research has been supported by NSF, ONR, DARPA, Sony, Snap, and Intel.\u003C/p>","2025-08-19T20:48:19.249Z","213",{"id":1620,"name":1621,"alternativeText":7,"caption":7,"width":909,"height":909,"formats":1622,"hash":1628,"ext":1131,"mime":1134,"size":1629,"url":1630,"previewUrl":7,"provider":21,"provider_metadata":7,"createdAt":1631,"updatedAt":1631},279,"Mohit Gupta.jpg",{"thumbnail":1623},{"ext":1131,"url":1624,"hash":1625,"mime":1134,"name":1626,"path":7,"size":1627,"width":689,"height":689},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/thumbnail_Mohit_Gupta_5eb4623202.jpg","thumbnail_Mohit_Gupta_5eb4623202","thumbnail_Mohit Gupta.jpg",7.16,"Mohit_Gupta_5eb4623202",22.64,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/Mohit_Gupta_5eb4623202.jpg","2025-08-19T20:48:14.893Z",[],"-179",{"id":1635,"name":1636,"committee":7,"position":7,"affiliation":1637,"email":7,"biography":1638,"createdAt":1639,"updatedAt":1639,"url_path_id":1640,"contactPhoto":1641,"socialLinks":1673,"url_path":1674},115,"Seokho Yun","Samsung Advanced Institute of Technology (SAIT)","\u003Cp style=\"text-align:justify;\">Seokho Yun is Vice President of Technology at the Samsung Advanced Institute of Technology (SAIT), where he leads the Photonics Research Team. His research focuses on meta-photonics and advanced image sensor technologies, with an emphasis on sensitivity enhancement, miniaturization, and novel optical functionalities. He received his Ph.D. in electrical engineering from Pennsylvania State University and conducted postdoctoral research at the Materials Research Science & Engineering Center. Since joining Samsung Electronics in 2012, he has driven the development of next-generation image sensor technology, including the world’s first commercial image sensor with meta-photonic color-routing nanostructures.\u003C/p>","2025-08-24T20:39:42.306Z","217",{"id":1642,"name":1643,"alternativeText":7,"caption":7,"width":1644,"height":1645,"formats":1646,"hash":1669,"ext":1131,"mime":1134,"size":1670,"url":1671,"previewUrl":7,"provider":21,"provider_metadata":7,"createdAt":1672,"updatedAt":1672},281,"SeokhoYun_picture.jpg",2261,3020,{"large":1647,"small":1653,"medium":1658,"thumbnail":1664},{"ext":1131,"url":1648,"hash":1649,"mime":1134,"name":1650,"path":7,"size":1651,"width":1652,"height":57},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/large_Seokho_Yun_picture_f26ebaa582.jpg","large_Seokho_Yun_picture_f26ebaa582","large_SeokhoYun_picture.jpg",49.14,748,{"ext":1131,"url":1654,"hash":1655,"mime":1134,"name":1656,"path":7,"size":1657,"width":975,"height":64},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/small_Seokho_Yun_picture_f26ebaa582.jpg","small_Seokho_Yun_picture_f26ebaa582","small_SeokhoYun_picture.jpg",15.54,{"ext":1131,"url":1659,"hash":1660,"mime":1134,"name":1661,"path":7,"size":1662,"width":1663,"height":71},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/medium_Seokho_Yun_picture_f26ebaa582.jpg","medium_Seokho_Yun_picture_f26ebaa582","medium_SeokhoYun_picture.jpg",29.65,561,{"ext":1131,"url":1665,"hash":1666,"mime":1134,"name":1667,"path":7,"size":1668,"width":948,"height":689},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/thumbnail_Seokho_Yun_picture_f26ebaa582.jpg","thumbnail_Seokho_Yun_picture_f26ebaa582","thumbnail_SeokhoYun_picture.jpg",3.26,"Seokho_Yun_picture_f26ebaa582",458.13,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/Seokho_Yun_picture_f26ebaa582.jpg","2025-08-24T20:39:36.657Z",[],"-183",{"id":1676,"name":1677,"committee":7,"position":7,"affiliation":1678,"email":7,"biography":1679,"createdAt":1680,"updatedAt":1680,"url_path_id":1681,"contactPhoto":1682,"socialLinks":1697,"url_path":1698},116,"Brian A. Wandell","Stein Family Professor of Psychology' Electrical Engineering, Ophthalmology and Graduate School of Education (by courtesy), Stanford University","\u003Cp style=\"text-align:justify;\">Brian A. Wandell is the Isaac and Madeline Stein Family Professor at Stanford University, where he has been a faculty member in the Psychology department since 1979. He also holds courtesy appointments in Electrical Engineering, Ophthalmology, and the Graduate School of Education.\u003Cbr> \u003C/p>\u003Cp style=\"text-align:justify;\">Wandell's research focuses on vision science and image systems engineering. His work includes the study of visual disorders, reading development in children, and the creation of digital imaging devices and algorithms. He co-founded the Stanford Center for Image Systems Engineering Program with Professor Emeritus Joseph Goodman.\u003Cbr> \u003C/p>\u003Cp style=\"text-align:justify;\">Wandell was the Founding Director of the Center for Cognitive and Neurobiological Imaging and served as the Deputy Director of the Wu Tsai Neuroscience Institute. He has co-founded two companies: Flywheel Exchange in 2015 and Image Data Management in 2023.\u003C/p>\u003Cp style=\"text-align:justify;\">\u003Cbr>Among his honors for his contributions to science, Wandell was named Electronic Imaging Scientist of the Year and received the Tillyer Prize from the Optical Society of America. He is an elected member of the American Academy of Arts and Sciences (2011) and the US National Academy of Sciences (2003). In 2021-2022, he was awarded the Proctor Medal from the Association for Research in Vision and Ophthalmology.\u003C/p>","2025-08-24T20:46:53.860Z","218",{"id":1683,"name":1684,"alternativeText":7,"caption":7,"width":1685,"height":1686,"formats":1687,"hash":1693,"ext":17,"mime":18,"size":1694,"url":1695,"previewUrl":7,"provider":21,"provider_metadata":7,"createdAt":1696,"updatedAt":1696},282,"wandell-portrait.png",226,291,{"thumbnail":1688},{"ext":17,"url":1689,"hash":1690,"mime":18,"name":1691,"path":7,"size":1692,"width":210,"height":689},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/thumbnail_wandell_portrait_ee70734667.png","thumbnail_wandell_portrait_ee70734667","thumbnail_wandell-portrait.png",43.56,"wandell_portrait_ee70734667",39.08,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/wandell_portrait_ee70734667.png","2025-08-24T20:46:42.560Z",[],"-184",{"id":948,"name":1700,"committee":7,"position":7,"affiliation":1701,"email":7,"biography":1702,"createdAt":1703,"updatedAt":1703,"url_path_id":1704,"contactPhoto":1705,"socialLinks":1732,"url_path":1733},"Zhao Wang","Research Scientist at Meta Reality Labs","\u003Cp style=\"text-align:justify;\">Zhao Wang received his Ph.D. in Electrical Engineering from the University of Texas at Dallas in 2012. He is currently a Research Scientist at Meta Reality Labs. Prior to joining Meta, Dr. Wang held positions at Texas Instruments, Qualcomm, Apple, and TSMC, where he contributed to advanced research and development in the semiconductor and electronics industries. Dr. Wang is the author of more than ten publications and holds over ten patents in his field.\u003Cbr> \u003C/p>","2025-08-24T20:51:48.781Z","219",{"id":1706,"name":1707,"alternativeText":7,"caption":7,"width":1708,"height":1709,"formats":1710,"hash":1728,"ext":17,"mime":18,"size":1729,"url":1730,"previewUrl":7,"provider":21,"provider_metadata":7,"createdAt":1731,"updatedAt":1731},283,"Zhao .png",950,942,{"small":1711,"medium":1717,"thumbnail":1723},{"ext":17,"url":1712,"hash":1713,"mime":18,"name":1714,"path":7,"size":1715,"width":64,"height":1716},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/small_Zhao_b6b3efd25b.png","small_Zhao_b6b3efd25b","small_Zhao .png",314.41,496,{"ext":17,"url":1718,"hash":1719,"mime":18,"name":1720,"path":7,"size":1721,"width":71,"height":1722},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/medium_Zhao_b6b3efd25b.png","medium_Zhao_b6b3efd25b","medium_Zhao .png",650.38,744,{"ext":17,"url":1724,"hash":1725,"mime":18,"name":1726,"path":7,"size":1727,"width":707,"height":689},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/thumbnail_Zhao_b6b3efd25b.png","thumbnail_Zhao_b6b3efd25b","thumbnail_Zhao .png",36.98,"Zhao_b6b3efd25b",237.6,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/Zhao_b6b3efd25b.png","2025-08-24T20:51:42.533Z",[],"-185",{"id":1735,"name":1736,"committee":7,"position":7,"affiliation":1737,"email":7,"biography":1738,"createdAt":1739,"updatedAt":1739,"url_path_id":1740,"contactPhoto":1741,"socialLinks":1770,"url_path":1771},118,"Dan McGrath","TechInsights","\u003Cp style=\"text-align:justify;\">Dan McGrath has worked for more than 45 years specializing in the device physics of pixels – CCD, CIS, and ToF – and in the integration of image-sensor process enhancements in the manufacturing flow. His career has spanned the full spectrum of image sensor design and application: small pixels for consumer; large pixels for high sensitivity; pixels for photons from infrared through visible to gamma rays, and for particle detection. Recent work has taken him into the realm of photon counting for night vision, scientific, and time-of-flight applications. He has had an abiding interest on dark current throughout his career. His present role is in reverse engineering as Senior Technology Fellow for Image Sensors at TechInsights. He also holds a position as a visiting researcher at ISAE Supaero in Toulouse, France, working on the nature of dark current in quantum image sensors.\u003Cbr> \u003C/p>\u003Cp style=\"text-align:justify;\">Dan received his Ph.D. in physics from The Johns Hopkins University on dimensional scaling of magnetic critical points in PdFe alloys. He has pursued his work at Texas Instruments, Polaroid, Imaging Devices, Atmel, Eastman Kodak, Aptina, BAE Systems, and GOODiX Technology; he has worked closely with manufacturing facilities in the USA, France, Italy, and Taiwan. He has been active in the organization and technical committees for conferences and workshops, and on the administrative committees for the IEEE Solid-State Circuits Society and the IEEE Sensors Council where he is Chair of the Industrial Liaison Committee. His position at TechInsights allows him to leverage product reverse engineering to impact the development of image sensor technology. His publications include the first megapixel CCD, the basis for dark current spectroscopy (DCS) and, recently, dark current in quantum image sensors.\u003C/p>","2025-08-24T20:57:45.944Z","220",{"id":1742,"name":1743,"alternativeText":7,"caption":7,"width":1744,"height":1744,"formats":1745,"hash":1766,"ext":17,"mime":18,"size":1767,"url":1768,"previewUrl":7,"provider":21,"provider_metadata":7,"createdAt":1769,"updatedAt":1769},284,"Dan McGrath.png",1392,{"large":1746,"small":1751,"medium":1756,"thumbnail":1761},{"ext":17,"url":1747,"hash":1748,"mime":18,"name":1749,"path":7,"size":1750,"width":57,"height":57},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/large_Dan_Mc_Grath_b1650a44ac.png","large_Dan_Mc_Grath_b1650a44ac","large_Dan McGrath.png",2266.95,{"ext":17,"url":1752,"hash":1753,"mime":18,"name":1754,"path":7,"size":1755,"width":64,"height":64},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/small_Dan_Mc_Grath_b1650a44ac.png","small_Dan_Mc_Grath_b1650a44ac","small_Dan McGrath.png",591.99,{"ext":17,"url":1757,"hash":1758,"mime":18,"name":1759,"path":7,"size":1760,"width":71,"height":71},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/medium_Dan_Mc_Grath_b1650a44ac.png","medium_Dan_Mc_Grath_b1650a44ac","medium_Dan McGrath.png",1295.44,{"ext":17,"url":1762,"hash":1763,"mime":18,"name":1764,"path":7,"size":1765,"width":689,"height":689},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/thumbnail_Dan_Mc_Grath_b1650a44ac.png","thumbnail_Dan_Mc_Grath_b1650a44ac","thumbnail_Dan McGrath.png",65.89,"Dan_Mc_Grath_b1650a44ac",815.14,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/Dan_Mc_Grath_b1650a44ac.png","2025-08-24T20:57:42.315Z",[],"-186",{"id":1773,"name":1774,"committee":7,"position":7,"affiliation":1775,"email":7,"biography":1776,"createdAt":1777,"updatedAt":1778,"url_path_id":1779,"contactPhoto":1780,"socialLinks":1813,"url_path":1814},120,"Syed Salman Rahman","Sr. Application Engineer at STMicroelectronics","\u003Cp style=\"text-align:justify;\">Salman Rahman is an Application Engineer specializing in MEMS sensors at STMicroelectronics, and is based in Schaumburg, Illinois. He holds a master's degree in electrical engineering from New York University. In addition to supporting industrial applications for MEMS sensors, Salman deeply focuses on developing presence sensing solutions, establishing laboratory infrastructures, and defining testing standards to characterize and validate these solutions. Since joining ST his primary involvement has been on integrating multiple sensing technologies, mainly the Infrared TMOS sensor and ToF Sensor with the goal of enabling emerging applications in context-aware IoT devices, smart home systems, and robotics applications.\u003C/p>","2025-09-11T13:22:45.348Z","2025-09-11T13:23:07.862Z","226",{"id":1781,"name":1782,"alternativeText":7,"caption":7,"width":1783,"height":1784,"formats":1785,"hash":1809,"ext":17,"mime":18,"size":1810,"url":1811,"previewUrl":7,"provider":21,"provider_metadata":7,"createdAt":1812,"updatedAt":1812},289,"SSR.png",3908,5511,{"large":1786,"small":1792,"medium":1798,"thumbnail":1804},{"ext":17,"url":1787,"hash":1788,"mime":18,"name":1789,"path":7,"size":1790,"width":1791,"height":57},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/large_SSR_840a07efcd.png","large_SSR_840a07efcd","large_SSR.png",93.15,710,{"ext":17,"url":1793,"hash":1794,"mime":18,"name":1795,"path":7,"size":1796,"width":1797,"height":64},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/small_SSR_840a07efcd.png","small_SSR_840a07efcd","small_SSR.png",31.94,355,{"ext":17,"url":1799,"hash":1800,"mime":18,"name":1801,"path":7,"size":1802,"width":1803,"height":71},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/medium_SSR_840a07efcd.png","medium_SSR_840a07efcd","medium_SSR.png",58.87,532,{"ext":17,"url":1805,"hash":1806,"mime":18,"name":1807,"path":7,"size":1808,"width":65,"height":689},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/thumbnail_SSR_840a07efcd.png","thumbnail_SSR_840a07efcd","thumbnail_SSR.png",5.59,"SSR_840a07efcd",1579.31,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/SSR_840a07efcd.png","2025-09-11T13:23:04.480Z",[],"-189","-137",{"id":357,"session":1817},{"id":357,"title":1818,"teaser":1819,"body":1820,"createdAt":1821,"updatedAt":1822,"publishedAt":1823,"url_path_id":1824,"contacts":1825,"url_path":1933},"Wireless and Batteryless Sensors: Towards AIoT","\u003Cp style=\"text-align:justify;\">Ambient Internet of Things (AIoT) is set to transform how everyday objects interact with their environment. By integrating battery-free devices capable of sensing factors like location, temperature, and humidity, AIoT enables seamless data transmission through existing wireless infrastructure such as smartphones, smart appliances, and access points. This advancement opens new opportunities for industries like retail, healthcare, and logistics to scale efficiently. Additionally, the data generated by AIoT fuels AI applications, helping both businesses and consumers make smarter, data-driven decisions.\u003C/p>","\u003Cp style=\"text-align:justify;\">However, implementing Ambient IoT brings key technical challenges:\u003Cbr>- a shift from designing for power-limited to energy-limited systems.\u003Cbr>- the need for efficient, innovative use of ambient energy sources with minimal output power.\u003Cbr>- development of specific circuits to overcome the specific need of this new use case.\u003Cbr>- exploration and adaptation of current low-power communication standards for this purpose.\u003Cbr>These challenges and potential solutions will be explored in this session, including a live demonstration.\u003C/p>","2025-06-27T13:34:34.471Z","2025-06-30T20:56:46.380Z","2025-06-27T13:34:36.459Z","171",[1826,1870,1893],{"id":1827,"name":1828,"committee":7,"position":7,"affiliation":1829,"email":7,"biography":1830,"createdAt":1831,"updatedAt":1832,"url_path_id":1833,"contactPhoto":1834,"socialLinks":1868,"url_path":1869},91,"Joao Ventura","University of Porto","\u003Cp style=\"text-align:justify;\">João Oliveira Ventura holds a PhD in Physics from the University of Porto and is Principal Researcher at the Institute of Physics for Advanced Materials, Nanotechnology and Photonics (IFIMUP), Faculty of Sciences, University of Porto. He leads the research area in nano-electronics and energy harvesting materials, focusing on advanced triboelectric nanogenerators and neuromorphic interfaces based on memristors. His work spans applications in harsh industrial environments and neurotechnology, and is supported by over €2.7M in competitive research funding.\u003C/p>\u003Cp style=\"text-align:justify;\">In parallel with his academic career, João is co-founder and CEO of inanoEnergy, a spin-off from the University of Porto developing advanced micro- and nano-generators for energy harvesting in Internet-of-Things and industrial environments. The company has established strong partnerships with CERN, Repsol, Pietro Fiorentini, and other international stakeholders, and is deploying self-powered monitoring systems across sectors including maritime, gas, and healthcare.\u003C/p>\u003Cp style=\"text-align:justify;\">João has authored over 200 peer-reviewed publications, 8 book chapters, and 1 book, and holds multiple patents. He serves on the editorial board of Nanoenergy Advances and is guest editor of Nano Energy. His work has received recognition from the European Space Agency, EIT InnoEnergy, and Repsol, and he is a frequent invited speaker at major conferences in nanotechnology and energy systems. He is also deeply involved in graduate teaching and student supervision, having mentored more than 60 MSc and PhD researchers.\u003C/p>","2025-06-27T13:33:05.640Z","2025-07-06T15:20:39.403Z","170",{"id":1835,"name":1836,"alternativeText":7,"caption":7,"width":1837,"height":1838,"formats":1839,"hash":1864,"ext":1841,"mime":1134,"size":1865,"url":1866,"previewUrl":7,"provider":21,"provider_metadata":7,"createdAt":1867,"updatedAt":1867},255,"JOV.JPG",2893,3040,{"large":1840,"small":1847,"medium":1853,"thumbnail":1858},{"ext":1841,"url":1842,"hash":1843,"mime":1134,"name":1844,"path":7,"size":1845,"width":1846,"height":57},".JPG","https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/large_JOV_4346805e69.JPG","large_JOV_4346805e69","large_JOV.JPG",95,951,{"ext":1841,"url":1848,"hash":1849,"mime":1134,"name":1850,"path":7,"size":1851,"width":1852,"height":64},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/small_JOV_4346805e69.JPG","small_JOV_4346805e69","small_JOV.JPG",26.67,476,{"ext":1841,"url":1854,"hash":1855,"mime":1134,"name":1856,"path":7,"size":720,"width":1857,"height":71},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/medium_JOV_4346805e69.JPG","medium_JOV_4346805e69","medium_JOV.JPG",713,{"ext":1841,"url":1859,"hash":1860,"mime":1134,"name":1861,"path":7,"size":1862,"width":1863,"height":689},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/thumbnail_JOV_4346805e69.JPG","thumbnail_JOV_4346805e69","thumbnail_JOV.JPG",4.14,148,"JOV_4346805e69",749.56,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/JOV_4346805e69.JPG","2025-07-06T15:19:48.487Z",[],"-140",{"id":1080,"name":1871,"committee":7,"position":7,"affiliation":1872,"email":7,"biography":1873,"createdAt":1874,"updatedAt":1875,"url_path_id":1876,"contactPhoto":1877,"socialLinks":1891,"url_path":1892},"Ibon Zalbide","KLISKATEK","\u003Cp style=\"text-align:justify;\">Dr. Ibon Zalbide received his M.S. in Telecommunications Engineering and Ph.D. in Electronics and Communications from the University of Navarra. From 2008 to 2023, he served as Chief Technology Officer at Farsens S.L., where he led the development of battery-free wireless sensing ICs. His work on the ROCYK100, an EPC GEN2 RFID chip with integrated sensing capabilities, resulted in several patents protecting key innovations in passive sensor technology.\u003C/p>\u003Cp style=\"text-align:justify;\">In 2023, he co-founded Kliskatek S.L., where he currently serves as CTO. The company develops complete sensing solutions using a variety of wireless technologies—including RFID, NFC, and Bluetooth—with a strong focus on energy harvesting and ultra-low-power design. Kliskatek’s systems are used in logistics, automotive, healthcare, and industrial monitoring, enabling autonomous sensing in environments where battery use is impractical.\u003C/p>\u003Cp style=\"text-align:justify;\">Dr. Zalbide has participated in multiple EU-funded R&D projects, including the SME Instrument program, contributing to the development of fully passive tire pressure sensors. He is also a faculty member at the University of Navarra, where he teaches courses in electronics and communications and promotes collaboration between academia and industry.\u003C/p>\u003Cp style=\"text-align:justify;\">His research interests include battery-free sensor systems, low-power IC design, wireless communication, and energy harvesting. He has authored several patents and technical publications in the field of wireless sensing and continues to contribute to the advancement of sustainable sensing technologies.\u003C/p>","2025-06-27T13:32:33.695Z","2025-07-01T12:38:52.015Z","169",{"id":1878,"name":1879,"alternativeText":7,"caption":7,"width":1369,"height":1880,"formats":1881,"hash":1887,"ext":1131,"mime":1134,"size":1888,"url":1889,"previewUrl":7,"provider":21,"provider_metadata":7,"createdAt":1890,"updatedAt":1890},252,"ibon.jpg",328,{"thumbnail":1882},{"ext":1131,"url":1883,"hash":1884,"mime":1134,"name":1885,"path":7,"size":1886,"width":1072,"height":689},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/thumbnail_ibon_e1275deb89.jpg","thumbnail_ibon_e1275deb89","thumbnail_ibon.jpg",3.86,"ibon_e1275deb89",14.76,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/ibon_e1275deb89.jpg","2025-07-01T12:38:46.491Z",[],"-139",{"id":1052,"name":1894,"committee":7,"position":7,"affiliation":1895,"email":7,"biography":1896,"createdAt":1897,"updatedAt":1898,"url_path_id":1899,"contactPhoto":1900,"socialLinks":1931,"url_path":1932},"Andoni Beriain","Tecnun (University of Navarra)","\u003Cp style=\"text-align:justify;\">Andoni Beriain earned a Master’s degree in Telecommunications Engineering from the University of Navarra in 2008, followed by a Master’s in Biomedical Engineering from the same institution in 2010. From September 2008 to April 2017, he worked at Ceit Research Center in the Communications and Electronics Department. During the first four years, he contributed as a Ph.D. student to the development of biomedical sensors, RFID devices, and high-speed, low-power analog ASICs.\u003Cbr>After completing his Ph.D., he continued as a research scientist, combining technical ASIC design with project management, proposal preparation, and lecturing at Tecnun (University of Navarra). Between 2014 and 2017, he led the RF Front End design and coordinated the analog system implementation for the ROCKY100 chip. This project, carried out under contract with Farsens and supported by the H2020 SME-Phase II initiative GT: Green Tire Pressure Monitoring System, resulted in two patents and the successful commercial launch of the ROCKY100 RFID chip, now marketed by RichRFID with over one million units produced.\u003Cbr>Since 2017, he has held a faculty and research position at Tecnun, focusing on RFID analog ASICs and energy harvester circuit design and optimization. Over the past eight years, he has consolidated his role as Principal Investigator in the field of energy harvesting, leading several publicly funded research projects, including SENSOFT (H2020 MSCA-RISE-2018), CAR2CAR (PID2020 RTC-2017), and the EIC-2022 PATHFINDER project BLOOD2POWER.\u003Cbr>His international research experience includes stays at LCIS – Grenoble INP (2020) and INANO-ENERGY in Porto (2021). He has authored more than ten scientific papers and one book chapter and has served on the editorial board of the JCR-indexed journal Internet Technology Letters since its launch.\u003Cbr>In 2023, he co-founded KLISKATEK, a startup focused on developing advanced wireless and batteryless solutions for industrial sensing applications.\u003C/p>","2025-06-27T13:31:36.174Z","2025-06-27T15:19:26.844Z","168",{"id":78,"name":1901,"alternativeText":7,"caption":7,"width":1902,"height":1903,"formats":1904,"hash":1927,"ext":1131,"mime":1134,"size":1928,"url":1929,"previewUrl":7,"provider":21,"provider_metadata":7,"createdAt":1930,"updatedAt":1930},"Andoni Beriain.jpg",1265,1897,{"large":1905,"small":1911,"medium":1917,"thumbnail":1922},{"ext":1131,"url":1906,"hash":1907,"mime":1134,"name":1908,"path":7,"size":1909,"width":1910,"height":57},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/large_Andoni_Beriain_4696a45a27.jpg","large_Andoni_Beriain_4696a45a27","large_Andoni Beriain.jpg",73.41,667,{"ext":1131,"url":1912,"hash":1913,"mime":1134,"name":1914,"path":7,"size":1915,"width":1916,"height":64},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/small_Andoni_Beriain_4696a45a27.jpg","small_Andoni_Beriain_4696a45a27","small_Andoni Beriain.jpg",23.41,333,{"ext":1131,"url":1918,"hash":1919,"mime":1134,"name":1920,"path":7,"size":1921,"width":64,"height":71},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/medium_Andoni_Beriain_4696a45a27.jpg","medium_Andoni_Beriain_4696a45a27","medium_Andoni Beriain.jpg",45.49,{"ext":1131,"url":1923,"hash":1924,"mime":1134,"name":1925,"path":7,"size":1926,"width":1243,"height":689},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/thumbnail_Andoni_Beriain_4696a45a27.jpg","thumbnail_Andoni_Beriain_4696a45a27","thumbnail_Andoni Beriain.jpg",3.87,"Andoni_Beriain_4696a45a27",257.47,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/Andoni_Beriain_4696a45a27.jpg","2025-06-27T15:18:26.878Z",[],"-138","-141",{"id":241,"session":1935},{"id":241,"title":1936,"teaser":1937,"body":1938,"createdAt":1939,"updatedAt":1940,"publishedAt":1941,"url_path_id":1942,"contacts":1943,"url_path":2061},"Emerging Trends in Chemical and Biochemical Sensors: MEMS, Electrochemical, and Optical Platform","\u003Cp style=\"text-align:justify;\">Emerging Trends in Chemical and Biochemical Sensors: Advances in MEMS, Electrochemical, Optical Platforms, and New Horizons in System Integration and AI/ML Data Analytics.\u003C/p>","\u003Cp style=\"text-align:justify;\">This workshop will explore the latest advancements across electrochemical, MEMS-based, and optical sensing platforms for chemical and biochemical applications. In addition to discussing novel sensor device innovations, we will introduce two critical emerging areas: sensor system integration strategies and the application of AI/ML techniques for advanced sensor data analysis. Through expert talks, real-world case studies, and dynamic discussions, participants will engage with breakthroughs in device design, new materials, multi-modal integration, and intelligent data interpretation. The workshop will provide a comprehensive view of how traditional sensor technologies are evolving alongside new enabling methodologies, fostering collaboration across hardware, systems, and data science communities.\u003C/p>","2025-06-27T13:38:04.866Z","2025-06-30T20:57:09.133Z","2025-06-27T13:38:08.101Z","174",[1944,1970,2003,2033],{"id":762,"name":1945,"committee":7,"position":7,"affiliation":7,"email":1946,"biography":41,"createdAt":1947,"updatedAt":1948,"url_path_id":1949,"contactPhoto":1950,"socialLinks":1968,"url_path":1969},"Anna Grazia Mignani","a.g.mignani@ifac.cnr.it","2025-03-13T12:33:43.224Z","2025-07-25T22:53:38.237Z","111",{"id":1065,"name":1951,"alternativeText":7,"caption":7,"width":1952,"height":1952,"formats":1953,"hash":1964,"ext":1131,"mime":1134,"size":1965,"url":1966,"previewUrl":7,"provider":21,"provider_metadata":7,"createdAt":1967,"updatedAt":1967},"Mignani.jpg",718,{"small":1954,"thumbnail":1959},{"ext":1131,"url":1955,"hash":1956,"mime":1134,"name":1957,"path":7,"size":1958,"width":64,"height":64},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/small_Mignani_25e3712b9c.jpg","small_Mignani_25e3712b9c","small_Mignani.jpg",29.59,{"ext":1131,"url":1960,"hash":1961,"mime":1134,"name":1962,"path":7,"size":1963,"width":689,"height":689},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/thumbnail_Mignani_25e3712b9c.jpg","thumbnail_Mignani_25e3712b9c","thumbnail_Mignani.jpg",5.01,"Mignani_25e3712b9c",52.64,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/Mignani_25e3712b9c.jpg","2025-07-25T22:53:35.852Z",[],"-92",{"id":279,"name":1971,"committee":1972,"position":7,"affiliation":1973,"email":7,"biography":41,"createdAt":1974,"updatedAt":1975,"url_path_id":1976,"contactPhoto":1977,"socialLinks":2001,"url_path":2002},"Arezoo Emadi","WiSe Co-Chair","University of Windsor, Canada","2025-01-16T17:49:21.380Z","2025-01-30T15:52:02.840Z","55",{"id":1978,"name":1979,"alternativeText":7,"caption":7,"width":1980,"height":1457,"formats":1981,"hash":1997,"ext":1131,"mime":1134,"size":1998,"url":1999,"previewUrl":7,"provider":21,"provider_metadata":7,"createdAt":2000,"updatedAt":2000},152,"arezoo_emadi_cei.jpg",640,{"small":1982,"medium":1987,"thumbnail":1992},{"ext":1131,"url":1983,"hash":1984,"mime":1134,"name":1985,"path":7,"size":1986,"width":1463,"height":64},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/small_arezoo_emadi_cei_26a8efd0f3.jpg","small_arezoo_emadi_cei_26a8efd0f3","small_arezoo_emadi_cei.jpg",24.59,{"ext":1131,"url":1988,"hash":1989,"mime":1134,"name":1990,"path":7,"size":1991,"width":1469,"height":71},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/medium_arezoo_emadi_cei_26a8efd0f3.jpg","medium_arezoo_emadi_cei_26a8efd0f3","medium_arezoo_emadi_cei.jpg",48.13,{"ext":1131,"url":1993,"hash":1994,"mime":1134,"name":1995,"path":7,"size":1996,"width":1475,"height":689},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/thumbnail_arezoo_emadi_cei_26a8efd0f3.jpg","thumbnail_arezoo_emadi_cei_26a8efd0f3","thumbnail_arezoo_emadi_cei.jpg",4.46,"arezoo_emadi_cei_26a8efd0f3",54.66,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/arezoo_emadi_cei_26a8efd0f3.jpg","2025-01-16T17:49:08.166Z",[],"-41",{"id":2004,"name":2005,"committee":7,"position":7,"affiliation":2006,"email":7,"biography":41,"createdAt":2007,"updatedAt":2008,"url_path_id":2009,"contactPhoto":2010,"socialLinks":2031,"url_path":2032},93,"Alan O Riordan","Tyndall National Institute","2025-06-27T13:35:43.785Z","2025-07-25T22:51:25.561Z","173",{"id":2011,"name":2012,"alternativeText":7,"caption":7,"width":2013,"height":2013,"formats":2014,"hash":2027,"ext":2016,"mime":2019,"size":2028,"url":2029,"previewUrl":7,"provider":21,"provider_metadata":7,"createdAt":2030,"updatedAt":2030},266,"Alan-Oriordan.webp",512,{"small":2015,"thumbnail":2022},{"ext":2016,"url":2017,"hash":2018,"mime":2019,"name":2020,"path":7,"size":2021,"width":64,"height":64},".webp","https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/small_Alan_Oriordan_88c8c82b1c.webp","small_Alan_Oriordan_88c8c82b1c","image/webp","small_Alan-Oriordan.webp",12.89,{"ext":2016,"url":2023,"hash":2024,"mime":2019,"name":2025,"path":7,"size":2026,"width":689,"height":689},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/thumbnail_Alan_Oriordan_88c8c82b1c.webp","thumbnail_Alan_Oriordan_88c8c82b1c","thumbnail_Alan-Oriordan.webp",3.24,"Alan_Oriordan_88c8c82b1c",14.96,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/Alan_Oriordan_88c8c82b1c.webp","2025-07-25T22:51:23.046Z",[],"-143",{"id":2034,"name":2035,"committee":7,"position":7,"affiliation":2036,"email":7,"biography":41,"createdAt":2037,"updatedAt":2038,"url_path_id":2039,"contactPhoto":2040,"socialLinks":2059,"url_path":2060},92,"Han Shao","Tyndal National Institute","2025-06-27T13:35:14.257Z","2025-07-25T22:51:09.431Z","172",{"id":2041,"name":2042,"alternativeText":7,"caption":7,"width":2043,"height":2043,"formats":2044,"hash":2055,"ext":1131,"mime":1134,"size":2056,"url":2057,"previewUrl":7,"provider":21,"provider_metadata":7,"createdAt":2058,"updatedAt":2058},265,"Han Shao.jpg",720,{"small":2045,"thumbnail":2050},{"ext":1131,"url":2046,"hash":2047,"mime":1134,"name":2048,"path":7,"size":2049,"width":64,"height":64},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/small_Han_Shao_aaa46c1b33.jpg","small_Han_Shao_aaa46c1b33","small_Han Shao.jpg",39.38,{"ext":1131,"url":2051,"hash":2052,"mime":1134,"name":2053,"path":7,"size":2054,"width":689,"height":689},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/thumbnail_Han_Shao_aaa46c1b33.jpg","thumbnail_Han_Shao_aaa46c1b33","thumbnail_Han Shao.jpg",6.03,"Han_Shao_aaa46c1b33",80.07,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/Han_Shao_aaa46c1b33.jpg","2025-07-25T22:51:06.913Z",[],"-142","-144",{"id":641,"session":2063},{"id":641,"title":2064,"teaser":2065,"body":41,"createdAt":2066,"updatedAt":2067,"publishedAt":2068,"url_path_id":2069,"contacts":2070,"url_path":2142},"Exploring Consumer Inertial MEMS – High-Tech Sensors at Your Fingertips","\u003Cp style=\"text-align:justify;\">Micro Electro-Mechanical Systems (MEMS) are integral to a wide range of modern applications. This workshop focuses on a specific class of MEMS sensors—inertial measurement units (IMUs)—which are commonly found in consumer electronic devices, enabling functionalities such as motion detection, orientation tracking, and gesture recognition. Participants will have the opportunity to explore these sensors hands-on—either by using the inertial sensors in their own smartphones or tablets, or by experimenting with demo sensor boards provided during the workshop.\u003C/p>","2025-06-27T13:42:11.172Z","2025-06-30T20:49:20.351Z","2025-06-27T13:42:13.150Z","177",[2071,2104],{"id":2072,"name":2073,"committee":7,"position":7,"affiliation":2074,"email":7,"biography":2075,"createdAt":2076,"updatedAt":2077,"url_path_id":2078,"contactPhoto":2079,"socialLinks":2102,"url_path":2103},94,"Dušan Radović","Bosch Sensortec GmbH","\u003Cp style=\"text-align:justify;\">Mr. Dušan Radović received his Dipl.-Ing. degree from the School of Electrical Engineering in Belgrade, Serbia in 1999. During his career, he worked on aircraft noise measurement, electronics for quartz oscillators, and integrated circuits for mobile communication. He participated in EU projects researching UWB technology. Since 2012, he works at Bosch Sensortec as sensor expert developing inertial sensors including BMI160 and BMI260. His expertise covers testing automation, sensor prototyping and applications.\u003C/p>","2025-06-27T13:41:10.621Z","2025-07-06T15:32:26.866Z","175",{"id":2080,"name":2081,"alternativeText":7,"caption":7,"width":57,"height":57,"formats":2082,"hash":2098,"ext":17,"mime":18,"size":2099,"url":2100,"previewUrl":7,"provider":21,"provider_metadata":7,"createdAt":2101,"updatedAt":2101},257,"Dusan Radovic.png",{"small":2083,"medium":2088,"thumbnail":2093},{"ext":17,"url":2084,"hash":2085,"mime":18,"name":2086,"path":7,"size":2087,"width":64,"height":64},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/small_Dusan_Radovic_b8739e235b.png","small_Dusan_Radovic_b8739e235b","small_Dusan Radovic.png",582.33,{"ext":17,"url":2089,"hash":2090,"mime":18,"name":2091,"path":7,"size":2092,"width":71,"height":71},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/medium_Dusan_Radovic_b8739e235b.png","medium_Dusan_Radovic_b8739e235b","medium_Dusan Radovic.png",1225.02,{"ext":17,"url":2094,"hash":2095,"mime":18,"name":2096,"path":7,"size":2097,"width":689,"height":689},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/thumbnail_Dusan_Radovic_b8739e235b.png","thumbnail_Dusan_Radovic_b8739e235b","thumbnail_Dusan Radovic.png",65.95,"Dusan_Radovic_b8739e235b",437.58,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/Dusan_Radovic_b8739e235b.png","2025-07-06T15:32:20.516Z",[],"-145",{"id":1845,"name":2105,"committee":7,"position":7,"affiliation":2074,"email":7,"biography":2106,"createdAt":2107,"updatedAt":2108,"url_path_id":2109,"contactPhoto":2110,"socialLinks":2140,"url_path":2141},"Rainer Schillinger","\u003Cp style=\"text-align:justify;\">Rainer Schillinger is a Senior Manager for Inertial Sensors at Bosch Sensortec in Reutlingen, Germany. He holds a Master's degree in Microsystems Engineering from the University of Freiburg, Germany. After over a decade of experience in sensor system architecture and ASIC design for both automotive and consumer electronics, he assumed a leadership role of a development team for MEMS-based inertial sensors in 2022. His technical expertise encompasses MEMS technology, analog and mixed-signal design, as well as sensor system integration.\u003C/p>","2025-06-27T13:41:38.139Z","2025-07-02T23:00:35.590Z","176",{"id":2111,"name":2112,"alternativeText":7,"caption":7,"width":2113,"height":2114,"formats":2115,"hash":2136,"ext":1131,"mime":1134,"size":2137,"url":2138,"previewUrl":7,"provider":21,"provider_metadata":7,"createdAt":2139,"updatedAt":2139},254,"IMG_0317.jpg",5760,3840,{"large":2116,"small":2121,"medium":2125,"thumbnail":2130},{"ext":1131,"url":2117,"hash":2118,"mime":1134,"name":2119,"path":7,"size":2120,"width":57,"height":1910},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/large_IMG_0317_5ebe98769b.jpg","large_IMG_0317_5ebe98769b","large_IMG_0317.jpg",35.48,{"ext":1131,"url":2122,"hash":2123,"mime":1134,"name":2124,"path":7,"size":882,"width":64,"height":1916},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/small_IMG_0317_5ebe98769b.jpg","small_IMG_0317_5ebe98769b","small_IMG_0317.jpg",{"ext":1131,"url":2126,"hash":2127,"mime":1134,"name":2128,"path":7,"size":2129,"width":71,"height":64},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/medium_IMG_0317_5ebe98769b.jpg","medium_IMG_0317_5ebe98769b","medium_IMG_0317.jpg",21.43,{"ext":1131,"url":2131,"hash":2132,"mime":1134,"name":2133,"path":7,"size":2134,"width":2135,"height":689},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/thumbnail_IMG_0317_5ebe98769b.jpg","thumbnail_IMG_0317_5ebe98769b","thumbnail_IMG_0317.jpg",3.53,234,"IMG_0317_5ebe98769b",1113.15,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/sensors25/IMG_0317_5ebe98769b.jpg","2025-07-02T23:00:12.742Z",[],"-146","-147",{"data":2144,"meta":2145},{"id":391,"heading":386,"createdAt":392,"updatedAt":393,"publishedAt":394,"url_path_id":395,"url_path":387,"contentType":128},{},1778853425460]